A teardown of the Huawei Mate 60 Pro left politicians and companies scratching their heads – how did Huawei manage to get a 5G-capable, 7nm chipset? Under current sanctions, this shouldn’t be possible. And yet here it is.
Now here is another teardown of the phone, this time in English rather than Chinese. Not that it makes the situation any clearer. Here is the phone’s motherboard uncovered:
The Huawei Mate 60 Pro motherboard
You can’t see the HiSilicon Kirin 9000s chipset itself, instead you see the SK Hynix RAM chips that sit above it. Those are themselves a mystery and SK launched an investigation into how just those made their way into the Mate 60 Pro (the company says it hasn’t sold to Huawei since 2020 hen the sanctions hit).
Anyway, you may have caught the PBKreviews drop test, which showed just how tough Huawei’s Kunlun 2 glass is – which is a good thing, since the 6.82” LTPO AMOLED display on the phone proved to be very difficult to remove and was irreparably damaged in the process.
Ultimately, the Huawei Mate 60 Pro was given a 5/10 repairability rating. Removing the display is a necessary step towards accessing the internals and that makes changing most things difficult.
Check out the full teardown video below:
